Projects
Stress Sensor Systems for Advanced Packaging Technology Evaluation
Project description
In cooperation with our industry partner we develop and validate innovative sensor systems based on piezoresistive silicon stress sensors which enable the laterally resolved detection of normal and shear stress components in packaged silicon sensors.
Start/End of project
01.01.2007 until 31.12.2009
Project manager
Prof. Dr. Oliver Paul
Contact person
Prof. Dr. Oliver Paul
Phone:+49 761 203 7191
Email:paul@imtek.de
Funding
Intel Corporation, USA