Publikationen

Alle Publikationen -

2011

2010
  1. V. Le Huy, J. Gaspar, O. Paul, S. Kamiya
    A Novel Fatigue Test with Ramping Stress Amplitude to Evaluate Fatigue Behavior of Polysilicon Thin Films
    Tech. Dig. 23rd IEEE International Conference MEMS, Hong Kong, China, 2010, 220-223

  2. Th. Martin, U. Gengenbach, P. Ruther, O. Paul, G. Bretthauer
    Actuation of a Triple-optics for an Intraocular Implant Based on a Piezoelectric Bender and a Compliant Silicon Mechanism
    12th Int. Conference on New Actuators, Bremen, Germany, 2010, 81-84

  3. C. Hassler, R. von Metzen, P. Ruther, T. Stieglitz
    Characterization of Parylene C as an Encapsulation Material for Implanted Neural Prostheses
    Wiley InterScience, 2010, 266-274

  4. M. Baumann, P. Gieschke, B. Lemke, O. Paul
    CMOS Sensor Chip with a 10x10 Array of Unit Cells for Mapping Five Stress Components and Temperature
    Tech. Dig. 23rd IEEE International Conference on MEMS, Hong Kong, China, 2010, 604-607

  5. K. Seidl, B. Lemke, H. Ramirez, S. Herwik, P. Ruther, O. Paul
    CMOS-Based High-Density Silicon Microprobe for Stress Mapping in Intracortical Applications
    Tech. Dig. 23rd IEEE International Conference on MEMS, Hong Kong, China, 2010, 35-38

  6. M. Baumann, P. Ruther, O. Paul
    CMOS-Based High-Pressure Sensor Using Surface Trenches for Sensitivity Enhancement
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 2644-2647

  7. P. Gieschke, O. Paul
    CMOS-integrated Sensor Chip for In-Plane and Out-of-Plane Shear Stress
    Proc. Eurosensors XXIV 2010, Linz / Austria, 2010, 1364-1367

  8. P. Ruther, M. Baumann, P. Gieschke, M. Herrmann, B. Lemke, K. Seidl, O. Paul
    CMOS-Integrated Stress Sensor Systems
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 2073-2077

  9. M. Herrmann, P. Gieschke, P. Ruther, O. Paul
    CMOS-Integrated Three-Axis Force Sensor for Coordinate Measurement Applications
    IEEE Sensors 2010 Conference, Waikoloa / USA, 2010, 2648-2652

  10. K. Seidl, T. Torfs, P. A. De Mazière, G. Van Dijck, R. Csercsa, B. Dombovari, Y. Nurcahyo, H. Ramirez, M. M. Van Hulle, G. A. Orban, O. Paul, I. Ulbert, H. Neves, P. Ruther
    Control and data acquisition software for high-density CMOS-based microprobe arrays implementing electronic depth control
    Biomed Tech 2010, 2010, 183-191

  11. J. Held, J. Gaspar, P. Ruhter, M. Hagner, A. Cismak, A. Heilmann, O. Paul
    Design of experiment characterization of microneedle fabrication processes based on dry silicon etching
    Journal of Micromechanics and Microengineering, 2010, 1-11

  12. G.J. Suanning, S, Kisban, S.C. Chen, P.J. Byrnes-Preston, C. Dodds, C. Tsai, P. Matteucci, S. Herwik, J.W. Morley, N.H. Lovell, O. Paul, T. STieglitz, P. Ruther
    Discrete Cortical Responses from Mulit-site Supra-Choroidal Electrical Stimulation in the Feline Retina
    32nd Annual International Conference of the IEEE EMBS, Buenos Aires, Argentina, 2010, 5879-5882

  13. P. Koester, C. Tautorat, J. Held, P. Ruther, J. Gaspar, O. Paul, H. Beikirch, J. Gimsa, W. Baumann
    GO-Bio 3: PoreGenic -1. Whole-Cell Patch Clamp Recordings with a 3D-MEA chip
    7th Int. Meeting on Substrate-Integrated Microelectrode Arrays, Reutlingen, Germany, 2010, 291-292

  14. P. Koester, C. Tautorat, J. Held, P. Ruther, J. Gaspar, O. Paul, H. Beikirch, J. Gimsa, W. Baumann
    GO-Bio 3: PoreGenic -2. Cardiomyocyte Action Potential Recordings with a 3D-MEA chip
    7th Int. Meeting on Subtrate-Integrated Microelectrode Arrays, Reutlingen, Germany, 2010, 293-294

  15. M. Cornils, A. Rottmann, O. Paul
    How to Extract the Sheet Resistance and Hall Mobility From Arbitrarily Shaped Planar Four-Terminal Devices With Extended Contacts
    IEEE Transactions on Electron Devices, 2010, 2087-2097

  16. K. Seidl, S. Spieth, S. Herwik, J. Steigert, R. Zengerle, O. Paul, P. Ruther
    In-Plane silicon probes for simultaneous neural recording and drug delivery
    Journal of Micromechanics and Microengineering, 2010, 1-11

  17. U. Bartsch, J. Gaspar, O. Paul
    Low-frequency two-dimensional resonators for vibrational micro energy harvesting
    Journal of Micromechanics and Microengineering, 2010, 1-12

  18. S. Brugger, O. Paul
    Magnetic field amplification by slender cuboid-shaped magnetic concentrators with a single gap
    Sensors and Actuators A: Physical, 2010, 135-139

  19. J. Gaspar, O. Paul, V. Chu, J.P. Conde
    Mechanical properties of thin silicon films deposited at low temperatures by PECVD
    Journal of Micromechanics and Microengineering, 2010, 1-6

  20. J. Stephan, E. Pagounis, M. Laufenberg, P. Ruther, O. Paul
    Mechanical Sensing Based on Ferromagnetic Shape Memory Alloys
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 2577-2580

  21. B. Lemke, M. Schmidt, J. Gutmann, P. Gieschke
    Nonlinear Piezoresistance of Silicon
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 1950-1953

  22. S. Kisban, T. Holzhammer, S. Herwik, O. Paul, P. Ruther
    Novel Method for the Assembly and Electrical Contacting of Out-of-Plane Microstructures
    Tech. Dig. 23rd IEEE International Conference on MEMS, Hong Kong, China, 2010, 484-487

  23. J. Gaspar, M. Schmidt, G. Pedrini, W. Osten, O. Paul
    Out-of-Plane Electrostatic Microactuators with Tunable Stiffness
    Tech. Dig. 23rd IEEE International Conference MEMS, Hong-Kong, China, 2010, 1131-1134

  24. B. Lemke, R. Baskaran, O. Paul
    Piezoresistive CMOS Sensor for the Localized Measurement of Five Independent Stress Components
    Tech. Dig. 23rd IEEE International Conference on MEMS, Hong Kong, China, 2010, 596-599

  25. M. Kaufmann, D. Kopp, F. Purkl, M. Baumann, P. Ruther, O. Paul
    Piezoresistive Response of Five-contact Vertical Hall Devices
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 562-565

  26. P. Ruther, S. Herwik, S. Kisban, K. Seidl, O. Paul
    Recent Progress in Neural Probes Using Silicon MEMS Technology
    IEEJ Transaction on Electrical and Electronic Engineering, Vol. 5, 2010, 505-515

  27. L. Grand, L. Wittner, S. Herwik, E. Göthelid, P. Ruther, S. Oscarsson, H. Neves, B. Dombovári, R. Csercsa, G. Karmos, I. Ulbert
    Short and Long Term Biocompatibility of NeuroProbes Silicon Probes
    Journal of Neuroscience Methods 189, 2010, 216-229

  28. J. Held, J. Gaspar, P. Ruther, M. Hagner, A. Cismak, A. Heilmann, O. Paul
    Solid Silver Microneedle Electrode Arrays for Intracellular Recording Applications
    7th Meeting on Substrate-Integrated Microelectrode Arrays, Reutlingen, Germany, 2010, 247-248

  29. B. Lemke, R. Baskaran, S. Ganapathysubramanian, O. Paul
    Stress Distribution Under Electroless Nickel Bumps Extracted Using Arrays of 7x7 Piezo-FETs
    IEEE SENSORS 2010 Conference, Waikoloa / USA, 2010, 2573-2576

  30. P. Alpuim, P. Gieschke, C. Ehling, E. Marins, M.I. Vasilevskiy, M.B. Schubert, J. Gaspar, O. Paul
    Study of the Piezoresistivity of Doped Nanocrystalline Silicon Thin Films
    E-MRS Spring Meeting 2010, Strasbourg, France, 2010

  31. G. van Dijck, A. Jezzini, S. Herwik, S. Kisban, K. Seidl, O. Paul, P. Ruther, F. Ugolotti Serventi, L. Fogassi, M. van Hulle, M. Umiltà
    Toward Automated Electrode Selection in the Electronic Depth Control Strategy for Multi-uni Recording
    Proc. ICONIP 2010, Sydney / Australia, 2010, 17-25


2009
  1. U. Bartsch, J. Gaspar, O. Paul
    A 2D electret-based resonant micro energy harvester
    Tech. Dig. 22nd IEEE International Conference on MEMS, Sorrento, Italy, 2009, 1043-1046

  2. S. Kisban, J. Kenntner, P. Janssen, R. v. Metzen, S. Herwik, U. Bartsch, T. Stieglitz, O. Paul, P. Ruther
    A Novel Assembly Method for Silicon-Based Neural Devices
    WC 2009, IFMBE Proceedings 25/IX, München, Germany, 2009, 107-110

  3. A.A.A. Aarts, H.P. Neves, R.P. Puers, S. Herwik, K. Seidl, P. Ruther, C. Van Hoof
    A slim out-of-plane 3D implantable CMOS based probe array
    Proc. Smart Systems Integration, Brussels, Belgium, 2009, 258-263

  4. T. Stieglitz, B. Rubehn, C. Henle, S. Kisban, S. Herwik, P. Ruther, M. Schuettler
    Brain-computer interfaces: an overview of the hardware to record neural signals from the cortex
    Progress in Brain Research, Vol 175, 2009, 297-315

  5. G. Pedrini, J. Gaspar, T. Wu, W. Osten, O. Paul
    Calibration of optical systems for the measurement of microcomponents
    2009, 203-210

  6. T. Alan, J. Gaspar, O. Paul, H. W. Zandbergen, F. Creemer, P.M. Sarro
    Characterization of Ultrathin Membranes to enable TEM Observation of Gas Reactions at High Pressures
    Proc. of the ASME 2009 Congress & Exposition IMECE2009, Lake Buena Vista, Florida, USA, 2009, 1-5

  7. P. Gieschke, Y. Nurcahyo, M. Herrmann, M. Kuhl, P. Ruther, O. Paul
    CMOS integrated stress mapping chips with 32 N-type or P-type piezoresistive field effect transistors
    Tech. Dig. 22nd IEEE International Conference on MEMS, Sorrento, Italy, 2009, 769-772

  8. K. Seidl, S. Herwik, Y. Nurcahyo, T. Torfs, M. Keller, M. Schüttler, H. Neves, T. Stieglitz, O. Paul, P. Ruther
    CMOS-based high-density silicon microprobe array for electronic depth control in neural recording
    Tech. Dig. 22nd IEEE International Conference on MEMS, Sorrento, Italy, 2009, 232-235

  9. J. Gaspar, J. Held, G. Pedrini, W. Osten, O. Paul
    Development of calibration standards for the optical measurement of in-plane displacements of micromechanical components
    Tech. Dig. 22nd IEEE International Conference on MEMS, Sorrento, Italy, 2009, 7-10

  10. G. Pedrini, J. Gaspar, W. Osten, O. Paul
    Development of Reference Standards for the Calibration of Optical Systems Used in the Measurement of Microcomponents
    The Author, 2009

  11. R.P. von Metzen, D. Egert, P. Ruther, T. Stieglitz
    Diffusion Limited Tapered Coating with Parylene C
    WC 2009, IFMBE Proceedings 25/IX, München, Germany, 2009, 96-99

  12. T. Kawai, J. Gaspar, V. Le Huy, O. Paul, S. Kamiya
    Evaluation of Fatigue Behavior of Polysilicon Thin Films
    Proc. JSME Mechanical Engineering Congress 2009, Morioka, Japan, 2009, 59-60

  13. B. Lemke, R. Baskaran, O. Paul
    Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
    Proceedings of the ASME 2009 InterPACK Conference, San Francisco, California, USA, 2009, 1-7

  14. H. Al Saeed, B. Panchaphongsaphak, P. Gieschke, I. Jonas, B. Lapatki
    Experimentelle Bestimmung der Drehmoment-Kraft-Verhältnisse verschiedener Closing-Loops
    82. Wissenschaftliche Jahrestagung, Mainz, Germany, 2009, Paper V4

  15. O. Paul, M. Cornils
    Explicit connection between sample geometry and Hall response
    2009, 1-3

  16. S. Herwik, S. Kisban, A.A.A. Aarts, K. Seidl, G. Girardeau, K. Benchenane, M.B. Zugaro, S.I. Wiener, O. Paul, H.P. Neves, P. Ruther
    Fabrication technology for silicon-based microprobe arrays used in acute and sub-chronic neural recording
    2009

  17. M.E. Schmidt, J. Gaspar, J. Held, S. Kamiya, O. Paul
    Highly efficient extraction of mechanical and linear and quadratic piezoresistive properties of poly-Si films using wafer-scale microtensile testing
    Tech. Dig. 22nd IEEE international Conference on MEMS, Sorrento, Italy, 2009, 599-602

  18. J. Held, J. Gaspar, M. Hagner, P. Ruther, O. Paul
    Hollow microneedle electrode arrays for intracellular recording applications
    Book of Abstracts 6th Deutschen BioSensor Symposium, Freiburg, Germany, 2009, 108

  19. J. Held, J. Gaspar, P.J. Koester, C. Tautorat, M. Hagner, A. Cismack, A. Heilmann, W. Baumann, P. Ruther, O. Paul
    Hollow microneedle electrode arrays for intracellular recording applications
    Tech. Dig. 22nd IEEE Interational Conference on MEMS, Sorrento, Italy, 2009, 220-223

  20. U. Bartsch, C. Sander, M. Blattmann, J. Gaspar, O. Paul
    Influence of Parasitic Capacitances on the Power Output of Electret-Based Energy Harvesting Generators
    PowerMEMS 2009, Washington DC, USA, 2009, 332-335

  21. J. Held, J. Gaspar, P.J. Koester, C. Tautorat, M. Hagner, A. Cismak, A. Heilmann, W. Baumann, P. Ruther, O. Paul
    Integration of Microfluidic Features with Microneedle Electrode Arrays for Intracellular Recording Applications
    Mikrosystemtechnik Kongress 2009, Berlin, 2009, Paper P3.1

  22. K. Sriperumbudur, P. Koester, M. Stubbe, C. Tautorat, J. Held, W. Baumann, J. Gimsa
    Local Electroporation of Single Adherent Cells by Micro-Structured Needle Elctrodes
    Proc. of the COMSOL Conference 2009, Bangalore, 2009

  23. J. Gaspar, T. Smorodin, M.E. Schmidt, C. Bohm, M. Stecher, O. Paul
    Mechanical Characterization of CMOS Metal Layers
    Transducers 2009, Denver, CO, USA, 2009, 1706-1709

  24. J. Kern, S. Loeckermann, A. Fritsch, I. Hausser, W. Roth, T. Magin, C. Mack. M. Müller, O. Paul, P. Ruther, L. Bruckner-Tuderman
    Mechanisms of fibroblast cell therapy for dystrophic epidermolysis bullosa: High stability of collagen VII favors long-term skin integrity
    2009

  25. M. Baumann, B. Lemke, P. Ruther, O. Paul
    Piezoresistive CMOS Sensors for Out-of-Plane Shear Stress
    IEEE Sensors 2009, Christchurch, New Zealand, 2009

  26. T. Kawai, J. Gaspar, O. Paul, S. Kamiya
    Prediction of Strength and Fatigue Lifetime of MEMS Structures with Arbitrary Shapes
    Transducers 2009, Denver, CO, USA, 2009, 1067-1070

  27. S. Hillebrecht, S. Herwik, I. Polian, P. Ruther, B. Becker, O. Paul
    Reliability characterization of interconnects in CMOS integrated circuits under mechanical stress
    IEEE CFP09RPS-CDR 47th Annual International Reliability Physics Symposium, Montreal, Canada, 2009, 562-567

  28. M. Cornils, O. Paul
    The Magnetic Calibration of Arbitrarily Shaped Hall Sensors in the Absence of Magnetic Fields
    Transducers 2009, Denver, CO, USA, 2009, 881-884

  29. B. Lemke, K. Kratt, R. Baskaran, O. Paul
    Towards piezoresistive CMOS sensors for out-of-plane stress
    Tech. Dig. 22nd IEEE International Conference on MEMS, Sorrento, Italy, 2009, 781-784

  30. B. Panchaphongsaphak, S. Rues, P. Gieschke, O. Paul, I.E. Jonas, B.G. Lapatki
    Untersuchung der Messgenauigkeit von intelligenten Brackets mittels Finite-Elemente-Analyse
    82. Wissenschaftliche Jahrestagung, Mainz, Germany, 2009

  31. J. Gaspar, M. Schmidt, J. Held, O. Paul
    Wafer-Scale Microtensile Testing of Thin Films
    Microelectromechanical Systems, Vol. 18, No. 5, 2009, 1062-1076


2008
  1. A.A.A. Aarts, H.P. Neves, I. Ulbert, L. Wittner, L. Grand, M.B.A. Fontes, S. Herwik, S. Kisban, O. Paul, P. Ruther, R.P. Puers, C. Van Hoof
    A 3D Slim-Base Probe Array for in Vivo Recorded Neuron Activity
    Proc. IEEE EMBS Conference, Vancouver, Canada, 2008, 5798-5801

  2. M. Cornils, O. Paul
    Beyond van der Pauw: Sheet Resistance Determination from Arbitrarily Shaped Planar Four-Terminal Devices with Extended Contacts
    Proc. IEEE Conference on Microelectronic Test Structures, Edinburgh, UK, 2008, pp. 23-28

  3. Oliver Paul, Pascal Gieschke, Benjamin Lemke
    CMOS-Integrated Stress Sensor Systems for Mechanical Sensing and Packaging Reliability Testing
    Materials Research Society Symposium Proceedings, Warrendate, USA, 2008, 1139-GG04-01

  4. J. Gaspar, J. Held, G. Pedrini, W. Osten, O. Paul
    Development of Calibration Standards for In-Plane Displacements of Microcomponents
    Proc. Eurosensors XXII, Dresden, Germany, 2008, 613-616

  5. P. Gieschke, J. Richter, J. Joos, P. Ruther, O. Paul
    Four-Degree-of-Freedom Solid State MEMS Joystick
    Proc. MEMS, Tucson, AZ, USA, 2008, pp. 86-89

  6. J. Yang, J. Gaspar, O. Paul
    Fracture Properties of LPCVD Silicon Nitride and Thermally Grown Silicon Oxide Thin Films From the Load-Deflection of Long Si3N4 and SiO2/Si3N4 Diaphragms
    Journal of Microelectromechanical Systems, Vol. 17, 2008, 1120-1134

  7. J. Gaspar, M. Schmidt, J. Held, O. Paul
    High-Throughput Wafer-Scale Microtensile Testing of Thin Films
    Proc. IEEE MEMS, Tucson, AZ, USA, 2008, 439-442

  8. S. Kisban, P. Janssen, S. Herwik, T. Stieglitz, O. Paul, P. Ruther
    Hybrid Microprobes for Chronic Implantation in the Cerebral Cortex
    Proc. IEEE EMBS Conference, Vancouver, Canada, 2008, 2016-2019

  9. P. Ruther, M. Wandt
    Innovativer miniaturisierter 3D-Kraftsensor für Koordinatenmesssysteme von Mikrokomponenten
    Sensor Magazin, 2008, 30-33

  10. P. Gieschke, Y. Nurcahyo, M. Herrmann, M. Kuhl, P. Ruther, O. Paul
    Integrated Stress Mapping Chip with 32 Piezoresistive Field Effect Transistors
    Proc. Eurosensors XXII, Dresden, 2008, pp. 292-295

  11. C. Tautorat, P.J. Koester, J. Held, J. Gaspar, P. Ruther, O. Paul, A. Cismak, A. Heilmann, J. Gimsa, H. Beikirch, L. Jonas, W. Baumann
    Intracellular Potential Meadurements of Adherently Growing Cells Using Micro-Needle Arrays
    Proc. µ-TAS, San Diego, California, USA, 2008, 1777-1780

  12. U. Bartsch, T. Huesgen, J. Gaspar, P. Woias, O. Paul
    Low-Temperature Adhesive Flip-Chip Bonding Using Cytop Combined with Electrical Stud Bump Interconnects
    Proc. MME-Workshop, Aachen, Germany, 2008, 411-414

  13. J. Gaspar, O. Paul, V. Chu, J.P. Conde
    Mechanical Properties and Reliability of Amorphous vs. Polycrystalline Silicon Thin Films
    Mater.Res. Soc.Symp.Proc Vol. 1066, MRS Spring Meeting, San Francisco, 2008, 1066-A15-04

  14. J. Held, J. Gaspar, P.J. Koester, C. Tautorat, A. Cismak, A. Heilmann, W. Baumann, A. Trautmann, P. Ruther, O. Paul
    Microneedle Arrays for Intracellular Recording Applications
    Proc. MEMS, Tucson, AZ, USA, 2008, pp. 268-271

  15. J. Held, J. Gaspar, P. Ruther, O. Paul
    Microneedle Electrode Arrays with Dielectrophoresis Electrodes for Intracellular Recording Applications
    Proc. Meeting on Substrate-Integrated Microelectrodes MEA, Reutlingen, 2008, 299-300

  16. T. Smorodin, Ch. Bohm, J. Gaspar, M. Schmidt, O. Paul, M. Stecher
    Modeling and improvement of a metallization system subjected to fast temperature cycle stress
    Proc. EuroSimE, Freiburg, Germany, 2008, 173-178

  17. T. Kawai, S. Amaki, J. Gaspar, P. Ruther, O. Paul, S. Kamiya
    Prediction of Fatigue Lifetime Based on Static Strength and Crack Extension Law-Fatigue Test of MEMS Materials Becomes Unnecessary
    Proc. MEMS, Tucson, AZ, USA, 2008, pp. 431-434

  18. S. Brugger, O. Paul
    Resonant Magnetic Microsensor with µT Resolution
    Proc. MEMS, Tucson, AZ, USA, 2008, pp. 944-947

  19. M. Cornils, O. Paul
    Reverse-magnetic-field reciprocity in conductive samples with extended contacts
    Journal of Applied Physics, Vol. 104, 2008, 024505 1-7

  20. S. Kamiya, S. Amaki, T. Kawai, N. Honda, P. Ruther, J. Gaspar, O. Paul
    Seamless interpretation of the strength and fatigue lifetime of polycrystalline silicon thin films
    Journal of Micromechanics and Microengineering, Vol. 18, 2008, No. 95023 1-10

  21. M. Cornils, O. Paul
    Sheet resistance determination of electrically symmetric planar four-terminal devices with extended contacts
    Journal of Applied Physics, Vol. 104, 2008, pp. 024503 1-10

  22. P. Gieschke, O. Paul, I.E. Jonas, B.G. Lapatki
    Smart Bracket for 3D-Force-Moment Monitoring in Orthodontics
    Proc. ESB Congress, Luzern, Switzerland, 2008, S216

  23. M. Schmidt, J. Gaspar, J. Held, O. Paul
    Strain Rate Dependent Mechanical Properties of Aluminum Thin Films Measured Using the Microtensile Test
    Proc. Eurosensors XXII, Dresden, Germany, 2008, 1603-1606

  24. M. Cornils, O. Paul
    The Magnetic Calibration and Optimization of Symmetric Hall Plates May be Accomplished even in The Absence of a Magnetic Field
    Proc. MEMS, Tucson, AZ, USA, 2008, pp. 940-943

  25. P. Ruther, A. Arts, O. Frey, S. Herwik, S. Kisban, K. Seidl, S. Spieth, A. Schumacher, M. Koudelka-Hep, O. Paul, T. Stieglitz, R. Zengerle, H. Neves
    The NeuroProbes Project - Multifunctional Probe Arrays for Neuro Recording and Stimulation
    Proc. Annual Conference of the IFESS, Freiburg, Germany, 2008, pp. 238-240

  26. T. Huesgen, U. Bartsch, B. Albrecht, P. Vulto, J. Gaspar, P. Woias
    Wafer-Level Dry-Film Photoresist Adhesive Bonding for 3D-MEMS Integration and Packaging
    Proc. MME, Aachen, Germany, 2008, 255-258


2007
  1. O. Paul, J. Gaspar, P. Ruther
    Advanced Silicon Microstructures, Sensors, and Systems
    Transactions on Electrical and Electronic Engineering, 2007, 199-215

  2. U. Bartsch, C. Bretthauer, T. Hehn, B. Mack, T. ungan, Y. Manoli, O. Paul, L. Reindl, H. Reinecke, U. Wallrabe, P. Woias
    Angewandtes "Micro Energy Harvesting"-Systemkonzept für energieautarke Mikrosysteme
    Mikrosystemtechnik Kongress 2007, Dresden, 2007, 797 - 800

  3. J. Gaspar, T. Smorodin, M. Stecher, O. Paul
    Bulge testing of silicon nitride thin films at the wafer level
    Proc. Mikrosystemtechnik Kongress, Dresden, 2007, pp881-884

  4. P. Ruther, S. Spinner, M. Cornils, O. Paul
    Cantilever-Based Tactile Sensor with Improved Sensitivity for Dimensional Metrology of Deep Narrow Drillings
    Transducers & Eurosensors '07, Lyon, France, 2007, 1469-1472

  5. S. Spinner, M. Cornils, O. Paul, P. Ruther
    Cantilever-Based Tactile Sensor with Improved Sensitivity for Dimensional Metrology of Microcomponents
    Mikrosystemtechnik Kongress 2007, Dresden, 2007

  6. K. Seidl, S. Spieth, S. Herwik, O. Paul, P. Ruther
    Cerebral Microprobes for Neural Recording Combined with Fluidic Functionality
    Proc. Biomed Tech, Berlin, 2007

  7. J. Held, J. Gaspar, P. Ruther, O. Paul
    Characterization of the DRIE Fabrication of Cell-Penetrating Microneedles
    Mkrosystemtechnik Kongress 2007, Dresden, 2007, 845 - 848

  8. P. Gieschke, J. Held, M. Doelle, J. Bartholomeyczik, P. Ruther, O. Paul
    CMOS Integrated Smart Cilia
    Mikrosystemtechnik Kongress, Dresden, 2007, 381 - 384

  9. B. Levey, P. Gieschke, M. Doelle, S. Spinner, A. Trautmann, P. Ruther, O. Paul
    CMOS-Integrated Silicon 3D Force Sensor System for Micro Component Coordinate Measurement Machines
    Tech. Dig. IEEE MEMS Conf., Kobe, Japan, 2007, 611-614

  10. N. Haj-Hosseini, R. Hoffmann, S. Kisban, T. Stieglitz, O. Paul, P. Ruther
    Comparative Study on the Insertion Behavior of Cerebral Microprobes
    Proceedings of the 29th Annual International Conference of the IEEE EMBS, Lyon, France, 2007, 4711-4714

  11. J. Gaspar, M. Schmidt, O. Paul
    Comparison of Improved Bulge and Microtensile Techniques for Mechanical Thin Film Characterization-Application ot Polysilicon
    Transducers & Eurosensors '07, Lyon, France, 2007, 575-578

  12. H.P. Neves, G.A. Orban, M. Koudelka-Hep, T. Stieglitz, P. Ruther
    Development of Modular Multifunctional Probe Arrays for Cerebral Applications
    Proc. of the 3rd International IEEE EMBS Conf. on Neural Engineering, Kohala Coast, Hawaii, USA, 2007, 104-109

  13. U. Bartsch, A. Trautmann, P. Ruther, J. Gaspar, O. Paul
    Electromechanical Transducers for Micro Energy Harvesting based on SOI Technology
    Transducers & Eurosensors '07, Lyon, France, 2007, 141-144

  14. U. Bartsch, J. Gaspar, P. Ruther, O. Paul
    Electrostatic Micro Energy Harvesting Devices based on SOI-Technology
    Mikrosystemtechnik Kongress 2007, Dresden, 2007, 785 -788

  15. U. Bartsch, P. Ruther, O. Paul
    Elektromechanischer Energiewandler basierend auf SOI-Technologie
    Technisches Messen 74, 2007, 636 - 641

  16. P. Gieschke, B. Lapatki, J. Bartholomeyczik, O. Paul
    First 1:1 Scale Smart Orthodontic Bracket
    Smart System Integration, Paris, France, 2007, 207-214

  17. S. Kamiya, T. Ozeki, K. Hirata, J. Gaspar, O. Paul, T. Inoue, H. Jindo
    Fracture strength and fatigue lifetime prediction of single crystalline silicon on the basis of process induced damages
    International Conference on Advanced Technology in Experimental Mechanics, Fukuoka, Japan, 2007, 41- 46

  18. S. Brugger, O. Paul
    Geometric Optimization and Microstructuring of Magnetic Concentrators for a Resonant Magnetic Sensor
    Transducers & Eurosensors ' 07, Lyon, France, 2007, 2377-2380

  19. J. Gaspar, Y. Nurcahyo, P. Ruther, O. Paul
    Mechanical Characterization of Silicon Nitride Thin-Films Using Microtensile Specimens with Integrated 2D Diffraction Gratings
    Tech. Dig. IEEE MEMS Conf., Kobe, Japan, 2007, 223-226

  20. J. Gaspar, P. Ruther and O. Paul
    Mechanical Characterization of Thin-Film Composites using the Load-Deflection Response of Multilayer Membranes - Elastic and Fracture Properties
    Materials Research Society Symposium, 2007

  21. P. Ruther, B. Lapatki, A. Trautmann, O. Paul
    Micro Needle Based Electrode Arrays for Surface Electromyography
    Mikrosystemtechnik Kongress, Dresden, 2007

  22. P. Ruther, B. Lapatki, A. Trautmann, O. Paul
    Micro Needle Based Electrode Arrays for Surface Electromyography
    Mikrosystemtechnik Kongress 2007, Dresden, 2007, 735 - 738

  23. S. Kisban, S. Herwik, K. Seidl, B. Rubehn, A. Jezzini, M.A. Umiltà, L. Fogassi, T. Stieglitz, O. Paul, P. Ruther
    Microprobe Array with Low Impedance Electrodes and Highly Flexible Polyimide Cables for Acute Neural Recording
    Proceedings of the 29th Annual International Conference of the IEEE EMBS, Lyon, France, 2007, 175-178

  24. J. Gaspar, M. Schmidt, J. Held, O. Paul
    Microtensile testing of thin-film materials
    Proc. Mikrosystemtechnik Kongress, Dresden, 2007, pp.865-868

  25. P. Ruther, S. Herwik, S. Kisban, K. Seidl, S. Spieth, B. Rubehn, N. Haj-Hosseini, J. Steigert, M. Daub, O. Paul, T. Stieglitz, R. Zengerle, H. Neves
    NeuroProbes - Development of Modular Multifunctional Probe Arrays for Neuroscience
    Mikrosystemtechnik Kongress 2007, Dresden, 2007, 739 - 742

  26. S. Brugger, W. Pfleging, O. Paul
    Novel Fabrication Process for the Integration of MEMS Devices with Thick Amorphous Soft Magnetic Field Concentrators
    Materials Research Society Symposium, 2007, Vol. 1052-DD07-11

  27. J. Gaspar, P. Ruther, O. Paul
    oad-Deflection Respons of Multilayer Membranes-Elastic and Fracture Properties
    Materials Research Society Symposium Proceedings, Vol 977, 2007

  28. S. Kamiya, J. Kuypers, A. Trautmann, P. Ruther, O. Paul
    Process Temperature-Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure
    Journal of Microeletromechanical Systems, Vol. 16. No. 2, 2007, 202-212

  29. J. Gaspar, M. Schmidt, J. Held, O. Paul
    Reliability of MEMS Materials: Mechanical Characterization of Thin-Films using the Wafer Scale Bulge Test and Improved Microtensile Techniques
    Material Research Society Symposium, Boston, 2007, 1052-DD01-02

  30. M. Cornils, O. Paul
    Sensor Calibration of Planar Four-Contact Devices with up to Two Extended Contacts
    Mikrosystemtechnik Kongress 2007, Dresden, 2007, 893 - 896

  31. M. Cornils, O. Paul
    Sensor Calibration of Planar Four-Contact Devices with up to Two Extended Contacts
    IEEE Sensors 2007, Atlanta, 2007, 1259 - 1262

  32. M. Cornils, M. Doelle, O. Paul
    Sheet Resistance Determination Using Symmetric Structures with Contacts of Finite Size
    2007, 2756-2761

  33. M. Dölle, J. Held, P. Ruther, O. Paul
    Simultaneous and Independent Measurement of Stress and Temperature Using a Single Field-Effect Transistor Structure
    Journal of Microelectromechanical Systems, Vol. 15, No. 5, 2007, 1232-1242

  34. B. Lapatki, J. Bartholomeyczik, P. Ruther, I. Jonas, O. Paul
    Smart Bracket for Multi-dimensional Force and Moment Measurement
    Journal of Dental Research, 2007, 73-78

  35. B. Lapatki, O. Paul
    Smart Brackets for 3D-Force-Moment Measurements in Orthodontic Research and Therapy-Developmental Status and Prospects
    2007, 377-396

  36. P. Gieschke, J. Held, M. Doelle, J. Bartholomeyczik, P. Ruther, O. Paul
    Smart Brush Based on a High Density CMOS Stress Sensor Array and SU-8 Microposts
    Tech. Dig. IEEE MEMS Conf., Kobe, Japan, 2007, 631-634

  37. J. Held, J. Gaspar, P. Ruther, M. Hagner, A. Cismak, A. Heilmann, O. Paul
    Systematic Characterization of DRIE-Based Fabrication Process of Silicon Microneedles
    Material Research Society Proc. Vol. 1052, Boston, 2007, 1052-DD07-07

  38. P. Gieschke, B. Levey, M. Doelle, A. Trautmann, P. Ruther, O. Paul
    Tactile CMOS-Integrated 3D Force Sensor System
    Mikrosystemtechnik Kongress, Dresden, 2007, 759 - 762

  39. H.P. Neves, P. Ruther
    The NeuroProbes Project
    Proceedings of the 29th Annual International Conference of the IEEE EMBS, Lyon, France, 2007, 6442-6444

  40. O. Paul, J. Gaspar
    Thin-film characterization using the bulge test
    Reliability of MEMS, O. Tabata, T. Tsuchiya, chap. 3, 2007, 67-121


2006
  1. A. Trautmann, F. Heuck, R. Denfeld, P. Ruther, O. Paul
    Detachable Silicon Microneedle Stamps for Allergy Skin Prick Testing
    Tech. Digest, IEEE MEMS 2006 Conference, Istanbul, Turkey, 2006, 434-437

  2. S. Spinner, J. Bartholomeyczik, B. Becker, M. Dölle, O. Paul
    Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors
    DTIP of MEMS & MOEMS, Stresa, Italy, 2006, 77-82

  3. U. Bartsch, A. Trautmann, O. Paul, P. Ruther
    Elektromechanischer Energiewandler basierend auf SOI-Technologie
    4. GMM Workshop Energieautarke Sensorik, Karlsruhe, Germany, 2006, 99-102

  4. S. Brugger, P. Simon, O. Paul
    Field Concentrator Based Resonant Magnetic Sensor
    IEEE Sensors 2006, EXCO, Deagu, Korea, 2006, 1016-1019

  5. Jinling Yang, Oliver Paul
    Fracture Properties of Thermal Silicon Oxide Thin Films from the Load-Deflection of Long SiNx/SiO2 Membranes
    IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Zhuhai, China, 2006, 1362-1367

  6. M. Dölle, D. Mager, P. Ruther, O. Paul
    Geometry optimization for planar piezoresistive stress sensors based on the pseudo-Hall effect
    Sensors and Actuators A 127, 2006, 261-269

  7. P. Ruther, J. Bartholomeyczik, S. Kibbel, T. Schelb, P. Gieschke, O. Paul
    Integrated CMOS-Based Sensor Array for Mechanical Stress Mapping
    IEEE Sensors 2006, EXCO, Deagu, Korea, 2006, 1131-1134

  8. J. Bartholomeyczik, J. Häfner, B. Lapatki, R. Ruther, T. Schelb, O. Paul
    Integrated Six-Degree-of-Freedom Sensing for Orthodontic Smart Brackets
    Tech. Digest, IEEE MEMS 2006 Conference, Istanbul, Turkey, 2006, 690-693

  9. P. Ruther, M. Dölle, J. Bartholomeyczik, P. Gieschke, O. Paul
    Integrierte Stresssensorik: Neue Techniken und Systeme
    ITG/GMA-Fachtagung Sensoren und Messsysteme, Freiburg, 2006, 60-64

  10. M. Dölle, C. Peters, P. Ruther, O. Paul
    Piezo-FET Stress-Sensor Arrays for Wire-Bonding Characterization
    Journal of Micoreletromechanical Systems, Vol. 15, No. 1, 2006, 120-130

  11. S. Spinner, J. Bartholomeyczik, B. Becker, M .Doelle, O. Paul, I. Polian, R. Roth, K. Seitz, P. Ruther
    Reliability Testing of Three-Dimensional Silicon Force Sensors
    18th ITG/GI/GMM-Workshop Testmethoden und Zuverlässigkeit von Schaltungen und Systemen, Titisee-Neustadt, Germany, 2006, 111-112

  12. M. Dölle, J. Held, P. Ruther, O. Paul
    Simultaneous and Independent Measurement of Stress and Temperature Using a Single Field Effect Transistor Based Sensor
    Tech. Digest, IEEE MEMS 2006 Conference, Istanbul, Turkey, 2006, 150-153

  13. J. Gaspar, P. Ruther, O. Paul
    Strength of LPCVD Silicon Nitride Thin Films
    Conf. Proc. Third International Conference on Multiscale Materials Modeling 2006, Freiburg, 2006, 966-969

  14. J. Bartholomeyczik, M. Dölle, P. Ruther, O. Paul
    The continuous spinning current (CSC) stress sensor method for the extraction of two stress components in an offset compensated manner
    Sensors and Actuators A 127, 2006, 255-260

  15. O. Paul, M. Dölle, J. Held, P. Ruther
    Unabhängige Stress- und Temperaturmessung mit Feldeffekt-Transistoren
    ITG/GMA-Fachtagung Sensoren und Messsysteme, Freiburg, 2006, 139-144


2005
  1. O. Paul, P. Ruther (invited book chapter)
    "Material Characterization"
    Chapter 2 of: CMOS-based Micro and Nano Electro Mechanical Systems, 2005, 69-135

  2. J.D. Jeyaprakash S. Samuel, P. Ruther, H.-P. Frerichs, M. Lehmann, O. Paul, J. Rühe
    A Simple Route towards the Reduction of Surface Conductivity in Gas Sensor Devices
    Sensors and Actuators B, 2005

  3. M. Schuster, N. Klein, P. Ruther, A. Trautmann, O. Paul, P. Kuzel, F. Kadlec
    An interconnected 2D-TM EBG structure for millimetre and sub-millimetre waves
    IEEE Journal on Selected Areas in Communications, Nanotechnologies for Communication, 2005

  4. O. Paul, P. Ruther, J. Bartholomeyczik, M. Doelle
    CMOS MEMS - A Critical Review
    Proc. Micromechanics Europe Workshop MME 2005, Göteborg, Schweden, 2005, 24 - 31

  5. Pascal Gieschke
    Design of an Integrated Piezo-FET Based Stress Sensor Array
    Freiburg, 2005


  6. J. Bartholomeyczik, S. Kibbel, P. Ruther, O. Paul
    Extraction of Compensated Sxx-Syy and Sxy Stresses from a Single Four-Contact
    Technical Digest, IEEE MEMS 2005 Conference, Miami Beach, 2005, 267-270

  7. J. Yang, O. Paul
    Fracture properties of thermal silicon oxide thin films from the load-deflection of long SiNx/SiO2 membranes
    Microelectromech. Syst. (IEEE), 2005

  8. M. Doelle, D. Mager, P. Ruther, O. Paul
    Geometry dependent sensitivity of piezoresistive stress sensors based on the pseudo-Hall effect
    Technical Digest, IEEE MEMS 2005 Conference, Miami Beach, 2005, 263-266

  9. L. Samid, C. Peters. P. Ruther, O. Paul, Y. Manoli
    Low-power sensor read-out circuits with continuous time sigma-delta modulators
    Proc. Analog 2005, Hannover, Germany, VDE, 2005, 151-155

  10. P. Ruther, J. Bartholomeyczik, A. Buhmann, A. Trautmann, K. Steffen, O. Paul
    Microelectromechanical HF resonators fabricated using a novel SOI-based low temperature process
    IEEE Sensors Journal, 2005

  11. W. Menz, J. Mohr, O. Paul
    Mikrosystemtechnik für Ingenieure
    ISBN 3-527-30536-X, 2005

  12. J. Bartholomeyczik, P. Ruther, O. Paul
    Multidimensional CMOS in-plane stress sensor
    IEEE Sensors Journal, 2005

  13. J. Bartholomeyczik, S. Brugger, P. Ruther, O. Paul
    Multidimensional CMOS In-Plane Stress Sensor
    2005, 872-882

  14. J. Bartholomeyczik, P. Ruther, O. Paul
    Novel cartesian lattice spinning method for the simple extraction of sxx-syy and sxy stresses and the Hall voltage from four-contact elements
    Tech. Digest Transducers 05 Conference, June 2005, Seoul, 2005, 2127-2130

  15. M. Doelle, P. Ruther, O. Paul
    Novel highly miniaturized multi-stress sensor based on field effect transducers with eight source/drain terminals
    Tech. Digest Transducers 05 Conference, June 2005, Seoul, 2005, 321-324

  16. M. Doelle, C. Peters, P. Ruther, O. Paul
    Piezo-FET stress sensor array for wire bonding characterization
    Microelectromech. Syst. (IEEE), 2005

  17. A. Trautmann, P. Ruther, O. Paul
    Replication of microneedle arrays using vaccum casting and hot embossing
    Tech. Digest Transducers 05 Conference, June 2005, Seoul, 2005, 1420-1423

  18. A. Trautmann, F. Heuck, C. Müller, P. Ruther, O. Paul
    Replication of Microneedle Arrays Using Vacuum Casting and Hot Embossing
    Mikrosystemtechnik Kongress 2005, Freiburg/Germany, 2005

  19. Simon Brugger
    Wireless Power Supply and Data Transmission for Stress Sensor Systems
    Freiburg, 2005



2004
  1. P. Ruther, M. Herrscher, O. Paul
    A micro differential thermal analysis (uDTA) system
    Tech. Digest IEEE MEMS 2004 Conference, Jan. 2004, Maastricht, Holland, 2004, 165-168

  2. M. Schuster, N. Klein, P. Ruther, A. Trautmann, O. Paul, P. Kuzel, F. Kadlec
    An interconnected 2D-TM EBG structure for millimetre and sub-millimetre waves
    Tech. Dig. PECS-V 2004, Intl. Symp. on Photonic and Electromagnetic Crystal Structures V, March 2004, 49, Kyoto, Japan, 2004

  3. S. Kamiya, J. Kuypers, A. Trautmann, P. Ruther, O. Paul
    Annealing temperature dependent strength of polysilicon measured using a novel tensile test structure
    Tech. Digest IEEE MEMS 2004 Conference, Jan. 2004, Maastricht, Holland, 2004, 185-188

  4. Trudpert Schelb
    Design of an Integrated Stress Sensor System
    Freiburg, 2004

  5. O. Paul
    Dünnschicht-Materialdaten für die Mikrotechnik
    VDI-Berichte Vol. 1829 (2004), 2004, 423-432

  6. A. Trautmann, P. ruther, W. Baumann, M. Lehmann, O. Paul
    Fabrication of Out-of-Plane Elctrodes for Intracellular Potential Measurements on Living Adherent Cells
    Book of Abstracts SIMEA-Meeting 2004, Jul. 2004, Tübingen, 2004, 79

  7. Dario Mager
    Geometry factors of resistive Stress-Sensors
    Freiburg, 2004

  8. Felix Schubert
    Six-Dimensional Force Characterization Setup for Packaged MEMS Devices
    Freiburg, 2004

  9. S. Armbruster, F. Schäfer, G. Lammel, J. Brasas, C. Schelling, S. Finkbeiner, M. Illing, P. Ruther, O. Paul
    Surface micromachining of monocrystalline silicon membranes using a silicon micro grid on sintered porous silicon
    Tech. Digest Eurosensors XVIII Conference, Sep. 2004, Rome, 2004, 22-23

  10. A. Trautmann, P. ruther, W. Baumann, M. Lehmann, O. Paul
    Three-Dimensional Nanoelectrodes for Biomedical Investigations on Living Cell Networks
    Tech. Digest Eurosensors XVIII Conference, Sep. 2004, Rome, 2004, 140-141

  11. M. Doelle, C. Peters, P. Gieschke, P. Ruther, O. Paul
    Two-dimensional high density piezo-FET stress sensor arrays for in -situ monitoring of wire bonding processes
    Tech. Digest IEEE MEMS 2004 Conference, Jan. 2004, Maastricht, Holland, 2004, 829-832

  12. Jürgen Andreas Wolf
    Wireless Power Transmission for Autonomous Microsystems
    Freiburg, 2004



2003
  1. Markus Herrscher
    A Micro Differential Scanning Calorimetry System
    Diplomarbeit, Freiburg, 2003
    pdf

  2. S. Armbruster, F. Schäfer, G. Lammel, H. Artmann, C. Schelling, H. Benzel, S. Finkbeiner, F. Lärmer, P. Ruther, O. Paul
    A novel micromachining process for the fabrication of monocrystalline Si-membranes using porous silicon
    Digest Tech. Papers, Transducers 2003, June 2003, Boston, USA, 2003, 246-249.

  3. Alexander Buhmann
    Assessment and Optimization of MEMS based Micro Resonators
    Diplomarbeit, Freiburg, 2003
    pdf

  4. P. Ruther, J. Bartholomeycik, A. Buhmann, O. Paul
    Characterization of microelectromecanical HF resonators fabricated using a SOI-based low temperature process
    Proc. IEEE Sensors 2003 Conference, Oct. 2003, Toronto, Canada, 2003, 820-824.

  5. Matthias Burg
    Charakterisierung rechteckiger Dünnschichtmembranen und Extraktion mechanischer Parameter
    Diplomarbeit, Freiburg, 2003
    pdf

  6. Christian Peters
    CMOS Based Stress Sensors-Novel Experimental Setup and Devices
    Diplomarbeit, Freiburg, 2003
    pdf

  7. P. Ruther, M. Ehmann, T. Lindemann, O. Paul
    Dependence of the temperature distribution in micro hotplates on heater geometry and heating mode
    Digest Tech. Papers, Transducers 2003, June 2003, Boston, USA, 2003, 73-76.

  8. Ralf Haug
    Mechanical Characterization of Silicon Micro Needle Arrays
    Diplomarbeit, Freiburg, 2003
    pdf

  9. Torsten Kramer
    Mechanical Properties of Compressive Silicon Nitride Thin Films
    Dissertation, Universität Freiburg, 2003

  10. T. Kramer, O. Paul
    Mechanical properties of compressively prestressed thin films extracted from pressure dependent ripple profiles of long membranes
    Proc. MEMS 2003 Conference, Jan. 2003, Kyoto, Japan, 2003, 678-681.

  11. U. Wagner, R. Müller-Fiedler, J. Bagdahn, B. Michel, O. Paul
    Mechanical reliability of epipoly MEMS structures under shock load
    Digest Tech. Papers, Transducers 2003, June 2003, Boston, USA, 2003, 175-178.

  12. A. Trautmann, P. Ruther, O. Paul
    Microneedle arrays fabricated using suspended etch mask technology combined with fluidic through wafer vias
    Proc. MEMS 2003 Conference, Jan. 2003, Kyoto, Japan, 2003, 682-685.

  13. W. Menz, J. Mohr, O. Paul
    Microsystem Technology (chinesische Übersetzung)
    ISBN 7-5025-4692-8, 2003

  14. J. Bartholomeyczik, P. Ruther, A. Buhmann, K. Steffen, O. Paul
    Novel low temperature SOI-based fabrication process for high frequency micromechanical resonators
    CD-ROM Eurosensors XVII, Sept. 2003,, Guimaraes, Portugal, 2003, 779-782.

  15. M. Doelle, P. Ruther, O. Paul
    Novel stress sensors based on the pseudo-Hall response of MOSFETs
    Proc. MEMS 2003 Conference, Jan. 2003, Kyoto, Japan, 2003, 490-493.

  16. U. Wagner, W. Bernhard, R. Müller-Fiedler, B. Michel, O. Paul
    Reliability of micromachined membranes under particle impact
    Digest Tech. Papers, Transducers 2003, June 2003, Boston, USA, 2003, 436-439.

  17. .A. Trautmann, R. Haug, P. Ruther, O. Paul
    Robustness of silicon microneedle arrays penetrating into bulk materials
    CD-ROM Eurosensors XVII, Sept. 2003,, Guimaraes, Portugal, 2003, 414-417.

  18. M. Doelle, P. Ruther, O. Paul
    Shear Stress Sensitive Piezo-FET Stress Sensors with Offset Reduction of Nonmechanical Contributions
    CD-ROM Eurosensors XVII, Sept. 2003,, Guimaraes, Portugal, 2003, 189-192.

  19. P. Ruther, K. Colelli, H.-P. Frerichs, O. Paul
    Surface conductivity of a CMOS silicon nitride layer
    Proc. IEEE Sensors 2003 Conference, Oct. 2003, Toronto, Canada, 2003, 990-995.

  20. O. Paul, T. Kramer
    Symmetry transitions of compressively prestressed long membranes under pressure
    Digest Tech. Papers, Transducers 2003, June 2003, Boston, USA, 2003, 432-435.

  21. O. Paul and P. Ruther (invited paper)
    Testing the limits of silicon technology based MEMS materials
    Proc. 2003 Intl. Symposium on Micromechatronics and Human Science (MHS 2003), Oct. 2003, Nagoya, Japan, 2003, 1-9.

  22. P. Ruther, R. Janke, U. Schiller, O. Paul
    Thermomagnetic residual offset in integrated Hall plates
    IEEE Sensors Journal, 3 (6) (2003), 2003, 693-699.


2002
  1. Holger Welsch
    Bestimmung der Bruchfestigkeit von Silizium-Mikrosäule
    Diplomarbeit, Freiburg, 2002
    pdf

  2. Jinling Yang, C. Peters, O. Paul
    Fracture Properties of LPCVD Silicon Nitride Thin Films from the Load-Deflection of Long Membranes
    Sens. Actuators, A 97-98 (2002), 2002, 520-526.

  3. P. Ruther, U. Schiller, W. Buesser, R. Janke, O. Paul
    Influence of the junction field effect on the offset voltage of integrated Hall plate
    Eurosensors XVI, Sept. 2002, Prag, Tchechien, 2002, 1209-1212

  4. Julian Bartholomeyczik
    Micro-Electromechanical Resonators - Technology and Design
    Diplomarbeit, Freiburg, 2002
    pdf

  5. Reinhold Jurischka
    Microhotplate-basierte Metalloxid-Gassensoren in CMOS-Technologie
    Diplomarbeit, Freiburg, 2002

  6. A. Trautmann, P. Ruther, O. Paul
    Novel microneedle arrays fabricated using suspended etch masks
    Eurosensors XVI, Sept. 2002, Prag, Tchechien, 2002, 433-436.

  7. Michael Dölle
    Piezo Field Effect Transistors
    Diplomarbeit, Freiburg, 2002
    pdf

  8. Walter Greger
    Polymerbeschichtung kapazitiver chemischer Mikrosensoren
    Diplomarbeit, Freiburg, 2002

  9. T. Kramer, O. Paul
    Postbuckled Micromachined Square Membranes under Differential Pressure
    J. Micromech. Microeng., 12 (2002), 2002, 475-478.

  10. Kuno Colelli
    Surface Conductivity of Silicon Nitride
    Diplomarbeit, Freiburg, 2002
    pdf

  11. S. Hafizovic, O. Paul
    Temperature Dependent Thermal Conductivities of CMOS Layers by Micromachined Thermal van der Pauw Test Structures
    Sens. Actuators, A 97-98 (2002), 2002, 246-252.

  12. M. Ehmann, T. Lindemann, P. Ruther, O. Paul
    Temperature distribution in micro hotplates
    Proc. MME 2002 Workshop, 6-8 Oct. 2002, Sinaia, Romania, 2002, 307-310

  13. Timo Lindemann
    Temperature Distribution in Micro Hotplates
    Diplomarbeit, Freiburg, 2002
    pdf

  14. M. Ehmann, P. Ruther, F. Schubert, O. Paul
    Thermally activated ageing of polysilicon
    Proc. IEEE Sensors 2002 Conference, Vol. 2, June 12-14, 2002, Orlando, USA, 2002, 602-606.

  15. P. Ruther, W. Buesser, R. Janke, U. Schiller, O. Paul
    Thermomagnetic residual offset in integrated Hall plates
    Proc. IEEE Sensors 2002 Conference, Vol. 2, June 12-14, 2002, Orlando, USA, 2002, 763-766.


2001
  1. A. Schaufelbuehl, N. Schneeberger, U. Münch, M. Wälti, O. Paul, O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Doering, M. Loepfe
    256-Pixel CMOS-Integrated Thermoelectric Infrared Sensor Array
    Proc. MEMS 2001, Jan. 21-25 (2001), Interlaken, Switzerland, 2001, 200-203.

  2. M. Ehmann, P. Ruther, M. von Arx, H. Baltes, O. Paul
    Ageing Behavior of Polysilicon Heaters for CMOS Microstructures Operated at Temperatures up to 1200 K
    Proc. MEMS 2001, Jan. 21-25 (2001), Interlaken, Switzerland, 2001, 147-150.

  3. Jinling Yang, C. Peters, O. Paul
    Fracture Properties of LPCVD Silicon Nitride Thin Films from the Load-Deflection of Long Membranes
    Transducers 01, Digest of Technical Papers, June 10-14 (2001), Munich, Germany, 2001, 1394-1397.

  4. W. Menz, O. Paul, J. Rühe, H. Zappe
    Material Considerations for Micromachine Technology
    Proc. International Symposia on Materials Science for the 21st Century ISMS-21, May 2001, Vol. A (2001), Osaka, Japan, 2001, 112-123.

  5. U. Wagner, J. Franz, M. Schweiker, W. Bernhard, R. Müller-Fiedler, B. Michel, O. Paul
    Mechanical Reliability of MEMS-Structures under Shock Load
    Proc. 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Oct. 1-5 (2001), also published in Microelectronics Reliability Series , Vol. 41 (Pergamon, 2001) 1657-1662., Bordeaux, France,, 2001, 1657-1662

  6. H. Nakajima, P. Ruther, J. Mohr, M. Tsugai, T. Usami
    Micro-optical distance sensor fabricated by deep x-ray lithography
    Optical Engineering 40(8), 2001, 1667-1673

  7. W. Menz, J. Mohr, O. Paul
    Microsystem Technology
    ISBN 3-527-29634-4, 2001

  8. M. Ehmann, P. Ruther, M. von Arx, O. Paul
    Operation and Short-Term Drift of Polysilicon-Heated Microstructures at Temperatures up to 1200 K
    J. Micromech. Microeng., 11 (2001), 2001, 397-401.

  9. T. Kramer, T. Brenner, O. Paul
    Postbuckled Micromachined Square Membranes under Differential Pressure
    Proc. Micromachining Europe MME 01, Sept. 16-18 (2001), Cork, Ireland, 2001, 289-292.

  10. T. Kramer, O. Paul
    Postbuckled Micromachined Square Thin Film Membranes under Differential Pressure
    Mat. Res. Soc. Symp. Proc. Vol. 695, 2001, 79-84.

  11. T. Kramer, O. Paul
    Surface Micromachined Ring Test Structures to Determine Mechanical Properties of Compressive CMOS IC Thin Films
    Sensors and Actuators, A 92 (2001), 2001, 292-298.

  12. S. Hafizovic, O. Paul
    Temperature Dependent Thermal Conductivities of CMOS Layers by Micromachined Thermal van der Pauw Test Structures
    Transducers 01, Digest of Technical Papers, June 10-14 (2001), Munich, Germany, 2001, 1398-1401.

  13. Uwe Schiller
    Thermomechanical Offset in Integrated Hall Plates
    Diplomarbeit, 2001


  14. A. Schaufelbühl, N. Schneeberger, U. Münch, M. Wälti, O. Paul, O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Doering, M. Läpfe,
    Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
    IEEE Journal of Microelectromechanical Systems 10 (2001), 2001, 503-510


2000
  1. O. Paul, P. Ruther, L. Plattner and H. Baltes
    A Thermal van der Pauw Test Structure
    IEEE Trans. Semiconductor Manufacturing, Vol. 13 , No. 2 (2000), 2000, 159-166.

  2. P. Ruther, M. Burg, C. Steinert, O. Paul
    Humidity Micro Sensors using Silica Aerogel Thin Films,
    Proc. CD-ROM, Eurosensors XIV, Aug. 27-30 (2000), Kopenhagen, Dänemark, 2000, 79-82.

  3. M. Ehmann, P. Ruther, O. Paul
    Operation and Ageing of Polysilicon-Heated Microstructures at Temperatures up to 1100 K
    Proc. Micromachining Europe MME 2000, Oct. 1-3, 2000,, Uppsala, Germany, 2000

  4. M. von Arx, O. Paul, H. Baltes,
    Process Dependent Thin Film Thermal Conductivities for Thermal CMOS MEMS
    J. Microelectromechanical Systems, Vol. 9, No.1 (2000), 2000, 136-145.

  5. T. Kramer, O. Paul
    Surface Micromachined Ring Test Structures to Determine Mechanical Properties of Compressive CMOS IC Thin Films,
    Proc. CD-ROM, Eurosensors XIV, Aug. 27-30 (2000), Kopenhagen, Dänemark, 2000, 25-28.


1999
  1. D. Westberg, O. Paul, G.I. Andersson, H. Baltes
    A CMOS-compatible device for fluid density measurements fabricated by sacrificial aluminum etching,
    Sensors and Actuators A73 (1999), 1999, 243-251.

  2. O. Paul, L. Plattner and H. Baltes
    A Thermal van der Pauw Test Structure
    Proc. IEEE ICMTS«99, Gothenberg, Sweden, 1999, 56-61. Best paper award

  3. V. Ziebart, O. Paul, and H. Baltes
    Extraction of the coefficient of thermal expansion of thin films from buckled membranes
    MRS Fall Meeting (1998), MRS Proc. Vol. 546 (1999), 1999, 103-108.

  4. L. Plattner, M. Mayer, Ch. Lüchinger, O. Paul, H. Baltes
    In-Situ Measurement of Chip Temperature During Soft Solder Die Bonding Using Integrated Microsensors
    Proc. IMAPS99, 26-28 Oct. (1999), Chicago, USA, 1999, 213-220.

  5. M. Mayer, J. Schwizer, O. Paul and H. Baltes
    In-situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors
    Proc. Interpack 99, EEP-Vol. 26-1 (1999), Maui USA, 1999, 973-978.

  6. M. Mayer, O. Paul, D. Bolliger, H. Baltes
    Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process
    Proc. ECTC«99, (IEEE, 1999), San Diego, USA, 1999, 463-468.

  7. O. Paul and H. Baltes
    Mechanical Behavior and Sound Generation Efficiency of Prestressed, Elastically Clamped and Thermomechanically Driven Thin Film Sandwiches
    J. Micromech. Microeng. 9, 1999, 19-29.

  8. P. Ruther, H. Nakajima, J.Mohr, St. Saenger
    Miniaturisierter Abstandssensor, hergestellt nach dem LIGA-Verfahren
    Technisches Messen, 66 (1999) 5, 1999, 176-184

  9. N. Schneeberger, O. Paul, H. Baltes,
    Spectral infrared absorption of CMOS thin film stacks,
    Technical Digest MEMS, 1999, 106-110.

  10. U. Münch, H. Baltes, O. Paul, E. Doering,
    Stress analysis of standard CMOS process,
    Proc. SPIE 3891, 1999, 344-351.

  11. V. Ziebart, O. Paul, H. Baltes,
    Strongly Buckled Square Micromachined Membranes
    J. Microelectromechanical Systems Vol. 8 Nr. 4 (1999), 1999, 423-432.

  12. J. Schwizer, M. Mayer, O. Paul, D. Bolliger, H. Baltes
    Thermosonic Ball Bonding: Friction Model Based on Integrated Microsensor Measurements
    Proc. 25th IEEE/CPMT Intl. Electronics Manufacturing Technology Symposium IEMT, Oct. (1999), Austin TX, USA, 1999, 108-114.

  13. A. Schaufelbuehl, N. Schneeberger, U. Muench, O. Paul, H. Baltes, C. Menolfi, Q. Huang,
    Uncooled Low-Cost Thermal Imager Using Micromachined CMOS Integrated Sensor Array
    Technical Digest Transducers, Vol. 1 (1999), 1999, 606-609.


1998
  1. Markus Emmenegger, Jan G. Korvink, Martin Bächtold, Martin von Arx, Oliver Paul, H. Baltes
    Application of Harmonic Finite Element Analysis to a CMOS Heat-Capacity Measurement Structure
    Sensors and Materials 10, 1998, 405-412.

  2. H. Baltes, O. Brand, O. Paul
    CMOS MEMS technology and CAD: the case of thermal microtransducers
    SPIE 1998 Symposium on Smart Structures and Materials, SPIE Proc. Vol. 3328 (1998), San Diego, USA, 1998, 2-12.

  3. S. Koller, V. Ziebart, O. Paul, O. Brand, H. Baltes, P. M. Sarro, M. J. Vellekoop
    Determination of mechanical material properties of piezoelectric ZnO films,
    SPIE 1998 Symposium on Smart Structures and Materials, SPIE Proc. Vol. 3328, San Diego, USA, 1998, 102-109.

  4. F. Mayer, G. Ofner, O. Paul, H. Baltes
    Flip-chip packaging for smart MEMS,
    SPIE 1998 Symposium on Smart Structures and Materials, SPIE Proc. Vol. 3328, San Diego, USA, 1998, 183-193.

  5. M. Mayer, O. Paul, D. Bolliger, and H. Baltes
    In-Situ Calibration of Wire Bonder Ultrasonic System Using Integrated Microsensor
    EPTC 98, Dec. 8-10 (1998),, Singapore, 1998, 219-223.

  6. M. Mayer, O. Paul, H. Baltes
    In-situ measurement of temperature and stress under bonding pads during bonding using integrated microsensors
    Proc. EMIT `98, (ISHM, 1998), Bangalore, 1998, 129-133.

  7. m. Waelti, N. Schneeberger, O. Paul, H. Baltes,
    Low Temperature Packaging of CMOS infrared Microsystems by Si-Al-Au Bonding
    Proc. Annual Symposium Electrochem. Soc. 1997, Paris, 1998, 147 - 154

  8. V. Ziebart, O. Paul, U. Münch, J. Schwizer, O. Paul and H. Baltes
    Mechanical Properties of Thin Films from the Load-Deflection of Long Clamped Plates,
    J. Microelectromechanical Systems 7 (1998), 1998, 320-328.

  9. M. Hornung, O. Brand, O. Paul, H. Baltes, C. Kuratli, Q. Huang
    Micromachined acoustic Fabry-Perot system for distance measurement
    Proc. MEMS 98 Workshop, (IEEE, 1998), Heidelberg, Germany, 1998, 643-648.

  10. M. von Arx, L. Plattner, O. Paul, H. Baltes
    Micromachined Hot Plate Test Structurs to Measure the Heat Capacity of CMOS IC Thin Films
    Sensors and Materials 10, 1998, 503-517.

  11. H. Baltes, O. Paul, O. Brand, (invited)
    Micromachined, thermally-based CMOS microsensors
    IEEE Proceedings, Special Issue on MEMS (1998), 1998, 1660-1678.

  12. V. Ziebart, O. Paul, U. Münch, H. Baltes
    Novel method to measure Poisson`s ratio of thin films
    MRS Fall Meeting (1997), MRS Proc. Vol. 505 (1998), 1998, 27-32.

  13. M. Waelti, N. Schneeberger, O.Paul, and H. Baltes,
    Package Quality Testing Using Integrated Pressure Sensor
    Proc. 1998 Intl. Symposium on Microelectronics IMAPS«98,, San Diego, USA, 1998, 981-986. Best Paper of Session Award

  14. O. Paul and J.G. Korvink, guest editors
    Sensors and Materials 10 (6), (1998).
    Special issue commemorating Prof. W. Menz« 60th birthday., 1998

  15. M. v. Arx, O. Paul, H. Baltes
    Test Structures to Measure the Heat Capacity of CMOS Layer Sandwiches
    IEEE Trans. Semiconductor Manufacturing, 11 (2), (IEEE 1997), 1998, 217 - 224

  16. O. Paul, N. Schneeberger, U. Münch, M. Wälti, A. Schaufelbühl, H. Baltes, C. Menolfi, Q. Huang, E. Doering, K. Müller, M. Loepfe (Invited)
    Thermoelectric Infrared Imaging Microsystem by Commercial CMOS Technology
    Proc. ESSDERC 98, Bordeaux, Frankreich, 1998, 52-55.

  17. U. Munch, N. Schneeberger, O. Paul, H. Baltes, E. Doering
    Thin Film Front Protection of CMOS Wafers against KOH
    SPIE Vol. 3514, Santa Clara, CA, 1998, 124 - 133


1997
  1. D. Westberg, O. Paul, G. Andersson, H. Baltes
    A CMOS-Compatible Device for Fluid Density Measurements,
    Proc. IEEE MEMS Workshop 1997, Nagoya, Japan, 1997, 278-283.

  2. M. Mayer, O. Paul, H. Baltes
    Complete set of piezoresistive coefficients of CMOS n-diffusion
    MME 1997, Southampton , UK, 1997, 203-206.

  3. F. Mayer, O. Paul, H. Baltes
    Flip-Chip Packaging for Thermal CMOS Anemometers,
    Proc. IEEE MEMS Workshop 1997, Nagoya, Japan, 1997, 203-208.

  4. U. Münch, D. Jaeggi, K. Schneeberger, O. Paul, H. Baltes, J. Jasper
    Industrial Fabrication Technology for CMOS Infrared Sensor Arrays,
    Transducers 1997 , Digest of Technical Papers, Chicago, USA, 1997, 205-208.

  5. M. Wälti, N. Schneeberger, O. Paul, H. Baltes
    Packaging of CMOS Infrared Detectors using Si-Al-Au Bonding
    Proc. 1997 Symp. of the Electrochemical Society, Vol. 97-36, 1997, 147-154.

  6. O. Paul, D. Westberg, M. Hornung, V. Ziebart, H. Baltes
    Sacrificial Aluminum Etching for CMOS Microstructures,
    Proc. IEEE MEMS Workshop 1997, Nagoya, Japan, 1997, 523-528.

  7. F. Mayer, A. Häberli, G. Ofner, H. Jacobs, O. Paul, H. Baltes
    Single-chip CMOS anemometer,
    Technical Digest Intl. Electron Devices Meeting IEDM `97, Washington, USA, 1997, 895-898. R. A. Haken award (best student paper award)

  8. M. von Arx, O. Paul, H. Baltes
    Test Structures to Measure the Heat Capacity of CMOS IC Sandwiches,
    Proc. IEEE ICMTS 1997, Monterey, 1997, 203-208.

  9. M. von Arx, O. Paul, H. Baltes (invited)
    Test Structures to Measure the Seebeck Coefficient of CMOS IC Polysilicon,
    IEEE Trans. Semiconductor Manufacturing, 10 (IEEE 1997), 1997, 201-208.

  10. M. von Arx, O. Paul, H. Baltes
    Thermoelectric Test Structure to Measure the Heat Capacity of CMOS Layer Sandwiches,
    Transducers 1997 , Digest of Technical Papers, Chicago, USA, 1997, 619-622.

  11. M. Hornung, O. Brand, O. Paul, H. Baltes
    Ultrasound Transducer for Distance Measurement,
    Transducers 1997 , Digest of Technical Papers, Chicago, USA, 1997, 441-444.


1996
  1. D. Westberg, O. Paul, G. Andersson, H. Baltes,
    A CMOS-compatible fluid density sensor,
    Proc. MME 96 Micro Mechanics Europe 1996 Workshop,, Barcelona, 1996, 279-282. Best poster award

  2. S. F. Trautweiler, O. Paul, J. Stahl, H. Baltes
    Anodically Bonded Silicon Membranes for Sealed and Flush Mounted Microsensors,
    Proceedings of MEMS`96, San Diego , USA, 1996, 61-66.

  3. A. Häberli, O. Paul, P. Malcovati, M. Faccio, F. Maloberti, H. Baltes
    CMOS Integration of a Thermal Pressure Sensor System,
    Proceedings of ISCAS 96, Vol. 1, Atlanta, USA, 1996, 377-380.

  4. H. Baltes, O. Paul, J.G. Korvink, M. Schneider, J. Bühler, N. Schneeberger, D. Jaeggi, P. Malcovati, M. Hornung, A. Häberli, M. von Arx, J. Funk (invited)
    IC MEMS Microtransducers,
    Technical Digest Intl. Electron Device Meeting IEDM 1996, San Francisco , USA, 1996, 521-524.

  5. N. Schneeberger, O. Paul, H. Baltes
    Optimization of CMOS Infrared Detector Microsystems,
    SPIE 96 Conference on Micromachining and Microfabrication, SPIE Proc. Vol. 2882, Austin TX, USA, 1996, 122-131.

  6. F. Mayer, G. Salis, O. Paul, H. Baltes
    Scaling of Thermal CMOS Gas Flow Microsensors: Experiment and Simulation,
    Proceedings of MEMS`96, San Diego , USA, 1996, 116-121.

  7. H. Baltes, O. Paul, J. G. Korvink (invited)
    Simulation Toolbox and Material Parameter Data Base for CMOS MEMS,
    Proc. MHS 96 Seventh Intl. Symposium on Micro Machine and Human Science, Nagoya, Japan, 1996, 1-8.

  8. David Westberg, O. Paul, H. Baltes,
    Surface micromachining by sacrificial aluminium etching,
    J. Micromech. Microeng. 6, 1996, 376-384.

  9. M. von Arx, O. Paul, H. Baltes
    Test Structures to Measure the Seebeck Coefficient of CMOS IC Polysilicon,
    Proc. of the Intl. Conference on Microelectronic Test Structures ICMTS`96, Trento, 1996, 117-122.Best paper award

  10. F. Mayer, O. Paul, H. Baltes
    Thermal CMOS Anemometers,
    SPIE 96 Conference on Micromachining and Microfabrication, SPIE Proc. Vol. 2882, Austin TX, USA, 1996, 236-246.

  11. H. Baltes, O. Paul, D. Jaeggi,
    Thermal CMOS sensors - an overview,
    Sensors Update 95,, 1996, 121-142.

  12. H. Baltes, O. Paul,
    Thermal sensors by CMOS and Micromachining,
    Sensors and Materials, Special Issue on Thermal Microsensors, 8, 1996, 409-421.


1995
  1. A. Bell, Y. Huang, O. Paul, Y. Nemirovsky, N. Setter
    A thin film pyroelectric detector
    Intl. Symposium on Integrated Ferroelectrics, Monterey, USA, 1995, (Also in Integrated Ferroelectrics 6 (1995) 231-240.)

  2. O. Paul, M. von Arx, H. Baltes
    CMOS IC layers: complete set of thermal conductivities
    Intl. Workshop on Semiconductor Characterization, NIST, Book of Abstracts,, Washington DC, 1995, (Also in Semiconductor Characterization: Present and Future Needs, eds. W. M. Bullis, D. G. Seiler

  3. P. Malcovati, A. Häberli, F. Mayer, O. Paul, F. Maloberti, H. Baltes
    Combined air humidity and flow CMOS microsensor with on-chip 15 bit sigma-delta A/D interface
    1995 Symposium on VLSI Circuits, Digest of Technical Papers, Kyoto, Japan, 1995, 45-46.

  4. M. von Arx, O. Paul, H. Baltes
    Determination of the heat capacity of CMOS layers for optimal CMOS sensor design,
    Eurosensors VIII, Proceedings, Toulouse, France (1994), 1995, 428-431(Also in Sens

  5. F. Mayer, O. Paul, H. Baltes
    Influence of design geometry and packaging on the response of thermal CMOS flow sensors
    Transducers 95 Digest of Technical Papers, Vol. 1, 1995, 528-531.

  6. P. Basedau, Q. Huang, O. Paul, H. Baltes
    Isolating analog circuits from digital interferences
    Fourth International Conference on Solid-State and Integrated-Circuit Technologies ICSICT`95, Beijing, China, 1995, 656-658.

  7. O. Paul, H. Baltes
    Novel fully CMOS compatible vacuum sensor
    Eurosensors VIII, Proceedings, Toulouse, France (1994), 1995, 143-146 (Also in Sen

  8. H. Baltes, J. G. Korvink, O. Paul
    Numerical Modelling and Materials Characterisation for Integrated Micro Electro Mechanical Systems
    Simulation of Semiconductor Devices and Processes, eds. H. Ryssel and P. Pichler, 1995, 1-9.

  9. N. Schneeberger, O. Paul, H. Baltes
    Optimized absorbers for CMOS infrared detectors
    Transducers 95 Digest of Technical Papers, Vol. 2, 1995, 648-651.

  10. N. Schneeberger, S. DŽteindre, O. Paul, H. Baltes
    Optimized CMOS infrared detector microsystems
    IEEE Tencon `95 Conference on Microelectronics & VLSI, Hong Kong, 1995, 198-201.

  11. O. Paul, M. von Arx, H. Baltes
    Process-dependent thermophysical properties of CMOS IC thin films,
    Transducers 95 Digest of Technical Papers, Vol. 1, 1995, 178-181.

  12. J. Bühler, J. Funk, O. Paul, F.-P. Steiner, H. Baltes
    Thermally actuated CMOS micro mirrors
    Eurosensors VIII, Proceedings, Toulouse, France (1994), 1995, 572-575 (Also in Sen

  13. O. Paul, J. Robadey, H. Baltes
    Two-dimensional integrated gas flow sensors by CMOS IC technology,
    J. Micromech. Microeng. 8, 1995, 243-250.

  14. O. Paul, O. Brand, R. Lenggenhager, H. Baltes
    Vacuum gauging with CMOS microsensors,
    J. Vac. Sci. Tech. A 13(3), 1995, 503-508.


1994
  1. O. M. Paul, J. Korvink, H. Baltes
    Determination of thermophysical properties of CMOS IC polysilicon
    Eurosensors VII, Proceedings, Budapest (1993), Sensors and Actuators A 41-42, Hungary, 1994, 161-164.

  2. H. Baltes, O. Brand, J. G. Korvink, R. Lenggenhager, O. Paul
    IMEMS - integrated micro electro mechanical systems by VLSI and micromachining
    ESSDERC `94, Proceedings of the 24th European Solid State Device Research Conference,, Edinburgh, 1994, 273-280.

  3. O. Paul, A. Häberli, P. Malcovati, H. Baltes
    Novel integrated thermal pressure gauge and read-out circuit by CMOS IC technology
    Intl. Electron Device Meeting IEDM 1994, Technical Digest, San Francisco, 1994, 131-134.

  4. A. Bell, Y. Huang, M. Kohli, O. Paul, P. Ryser, M. Forster
    PbTiO3 thin films for pyroelectric detection
    9th Intl. Symposium on Applications of Ferroelectrics ISAF, Conference Proceedings,, Pennsylvania State University, 1994, 691-694.

  5. O. Paul, H. Baltes
    Thermal vacuum sensor by CMOS IC technology and sacrificial metal etching
    Sensors and Materials 6 No. 2, 1994, 245-249.

  6. O. Paul, O. Brand, R. Lenggenhager, H. Baltes
    Vacuum gauging with IC technology compatible microsensors
    AVS 41st Natl. Symposium Book of Abstracts, Denver, USA, 1994, 122.


1993
  1. O. Paul, H. Baltes
    Measuring thermogalvanomagnetic properties of polysilicon for the optimization of CMOS sensors
    Transducers 93, Digest of Technical Papers,, Japan, 1993, 606-609.

  2. O. Paul, H. Baltes,
    Thermal conductivity of CMOS materials for the optimization of microsensors,
    MME 93 Micro Mechanics Europe 1993 Workshop Digest, FSRM, Neuch‰tel, 1993, 19-22 (Also in J. Micromech. Microeng. 3 (1993) 110-112.).


1992

1991
  1. O. Paul, S. Toscano, K. Totland and M. Landolt
    The spatial origin of the spin-polarization of secondary-electron emission from Fe
    Surf. Sci. 251/252, 1991, 27-30.


1990
  1. O. Paul
    Determination of energy-resolved inelastic mean free paths of electrons in Cs, Ta, Fe, Gd, and Au with spin-polarized secondary and Auger electron spectroscopy
    Ph.D. Thesis, ETH Zürich, No. 9210, 1990

  2. O. Paul, S. Toscano, W. Hürsch, M. Landolt
    Magnetic behaviour of Gd and Tb adlayers on Fe and Ni surfaces studied by spin-polarized Auger spectroscopy
    J. Magn. Magn. Mat. 84, L7, 1990


1989
  1. O. Paul, M. Taborelli, M. Landolt
    Fe auf Au(100): ein zweidimensionaler magnetischer Phasenübergang
    Verh. DPG(VI) 24, 1989, AM-13.7.

  2. M. Taborelli, O. Paul, M. Landolt
    Fe/Au(100): Magnetism in two dimensions and comparison to Fe surface-magnetism
    J. Phys. (Paris) 49 C8, 1989, 1659-1660.

  3. S. Toscano, O. Paul, M. Taborelli, M. Landolt
    Gd auf Ni(110): antiferromagnetische Kopplung untersucht mit spinpolarisierter Auger-Elektronenspektroskopie
    Verh. DPG(VI) 24, 1989, AM-13.6.

  4. O. Paul, S. Toscano, M. Landolt
    Gd-Adsorbatschichten auf Ni und Fe: Stark spinabhängige Streuung der niederenergetischen Elektronen
    Verh. DPG(VI) 24, 1989, 0-8.2.

  5. O. Paul, M. Taborelli, M. Landolt
    Magnetic and spectroscopic properties of epitaxial overlayers of Fe on Au(100) studied with spin-polarized Auger and secondary electrons
    Surf. Sci. 211, 1989, 724-731.

  6. W. Dürr, M. Taborelli, O. Paul, R. Germar, D. Pescia, M. Landolt
    Magnetic phase transition in two-dimensional ultra-thin Fe films on Au(100)
    Phys. Rev. Lett. 62, 1989, 206-209.


1988
  1. O. Paul, M. Taborelli, S. Zürcher, M. Landolt
    Fe auf Au(100): Spinabhängige Elektron-Elektron-Streuung
    Verh. DPG(VI) 23, 1988, O-10.3.

  2. W. Dürr, R. Germar, D. Pescia, W. Gudat, M. Taborelli, O. Paul, M. Landolt
    Ferromagnetic order in two dimensions observed for the single monolayer of Fe on Au(100)
    Europhys. Conf. Abstr. 12A, 1988, 212.

  3. O. Paul
    Inelastische Neutronenstreuung an Spinwellen- und Clusteranregungen des Systems CsMg1-xMnxBr3, 0.5_x_0.98
    Diploma Thesis, Paul-Scherrer-Institut, Labor für Neutronenstreuung, 1988, Report LN-112.

  4. M. Taborelli, O. Paul, S. Zürcher, M. Landolt
    Magnetisches Verhalten von dünnen Fe-Filmen auf Au(100)
    Verh. DPG(VI) 23, 1988, AM-8.64.

  5. O. Paul, M. Taborelli, S. Zürcher, M. Landolt
    Spinpolarisierte Elektronen-Kaskade in Fe83B17: Plasmonen- und Einteilchen-Anregungen
    Helv. Phys. Acta 61, 1988, 174.

  6. S. Zürcher, O. Paul, M. Taborelli, M. Landolt
    Spinpolarisierte Elektronen-Spektroskopie: Fe-Filme auf Au(100)
    Helv. Phys. Acta 61, 1988, 173.


1987

Journal Konferenz Diplomarbeit Dissertation Sonstiges Buch Patent Masterarbeit Bachelorarbeit

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