Prof. Dr. Oliver Paul

Professor

 
 

Address


E-Mail: paul@imtek.de
Telefon:+49 (0) 761 203-7191
Fax:+49 (0) 761 203-7192
Raum:103 00 084
 
 

1986

Diploma in physics (ETH Zurich)

1990

PhD (Dr. sc. nat., ETH Zurich)

1991-1992

Post-doctoral fellow at FhG-ISE, Freiburg, Germany

1992-1998

Senior scientist and group leader at the Physical Electronics Laboratory (headed by Prof. Dr. H. Baltes), ETH Zurich; lecturer at the Department of Electrical Engineering, ETH Zurich.

1998-date Professor, Chair of Microsystem Materials, Department of Microsystems Engineering (IMTEK),   the Faculty of Engineering, University of Freiburg, Germany.
1999-2002 Dean of Studies, Institute of Microsystem Technology IMTEK, University of Freiburg, Germany.
2002-2004 General Co-Chair, 17 th IEEE Conference on Microelectromechanical Systems MEMS 2004, Jan. 25-29, Maastricht, The Netherlands.
2003 Visiting professor at Ritsumeikan University, Kyoto, Japan.
2005-2009 Head of the DFG-funded Ph.D. research training program 1103 "Embedded Microsystems"
2006-2008 Director of IMTEK
2006-2008 Chairman of the examination board of the Faculty of Applied Sciences.
2009 Visiting professor at the Engineering Research Center for Wireless Integrated Microsystems (WIMS), University of Michigan, Ann Arbor, USA.
 
 
Research Interests
Former PhD Students
Research Activities
Professional society affilations, activities, honors
Teaching
Languages
Patents, publications, presentations
 
 

Research Interests

· Microsystems for physical sensing and biomedical applications
· Materials and fabrication technologies for microsystems
· Material properties of thin films
· Microelectromechanical systems (MEMS) based on commercial IC processes
· Quantitative, physical understanding of MEMS


 
 

Former PhD Students

Dominique Jaeggi Bookham Switzerland AG
Martin von Arx

ESEC SA, Cham, Switzerland

Niklaus Schneeberger Debiotech, Lausanne, Switzerland
Felix Mayer Co-Founder and CEO, Sensirion AG, Stäfa, Switzerland
Michael Mayer Professor, University of Waterloo, Canada
Volker Ziebart Mettler-Toledo GmbH, Nänikon, Switzerland
Torsten Kramer Robert Bosch GmbH, Reutlingen, Germany
Michael Ehmann Stiftung Caesar, Bonn, Germany
Simon Armbruster Robert Bosch GmbH, Reutlingen, Germany
Ulrich Wagner Robert Bosch GmbH, Gerlingen-Schillerhöhe, Germany
Julian Bartholomeyczik Northrop Grumman Litef GmbH, Freiburg, Germany
Michael Doelle Silicon Microstructures, Milpitas, USA
Achim Trautmann Robert Bosch GmbH, Stuttgart, Germany
Simon Brugger Testo AG, Lenzkirch, Germany
Martin Cornils Micronas GmbH, Freiburg, Germany
Jochen Held University of Tübingen, NMI, Reutlingen, Germany
Sebastian Kisban UP-MED GmbH, München, Germany
Ulrich Bartsch Sensirion AG, Stäfa, Switzerland
Stefan Hillebrecht


University of Freiburg, IfI, Freiburg, Germany
 
 

Research Activities
1998-date Research in process technology, materials preparation and characterization for MEMS based on silicon technology and related technologies; silicon based MEMS devices and systems.
 
  • Technology, materials, and processes for silicon-based MEMS:
   
  • KOH, TMAHW, DRIE, porous silicon etching
   
  • Through-wafer contacting
   
  • Surface micromachining: LTO and AL sacrificial layer micromachining
   
  • High-temperature (900°C) use of CMOS membranes
   
  • Nanomachining
       
 
  • Characterization of MEMS materials, processes, and devices:
   
  • Mechanical thin film properties: bulge and microtensile testing, indentation and shear testing; elastic properties, thermal expansion, fracture properties
   
  • Thermal thin film properties: dedicated test microstructures; thermal conductivity, heat capacity, thermoelectric coefficients
   
  • Reliability and aging properties of MEMS materials:
    shock resistance and cyclic fatigue
   
  • Packaging process characterization using FET-based stress sensor arrays
   
  • Electrical, thermal, mechanical, optical, magnetic testing of MEMS devices and systems
       
 
  • Development of MEMS for applications:
   
  • Microneedles and nanoneedles for dermatology and life sciences
   
  • Neural probes
   
  • Integrated stress sensors for packaging testing and force and torque sensing
   
  • Microstructures combined with magnetic shape memory alloys
   
  • Tactile sensor systems
   
  • Pressure sensor technology
   
  • Semiconductor Hall sensors
   
  • Resonant magnetic sensors
   
  • High temperature sintering of transducer ceramic thin films on CMOS
   
  • FET-based gas sensors, surface conductivity
   
  • Thin film membrane based thermal sensors
   
  • Differential scanning microcalorimetry
       
1996-1998 Swiss Priority Program MINAST (Micro and Nano System Technology)
 
  • Deputy module coordinator and project leader. Coordination and supervision of five projects (1,855,000 Swiss Francs in 1996), interaction with Program Management, and contract negotiations with industrial partners
   
1992-1998 Microsensors, Microsystems, Silicon Technology
 
  • CMOS-compatible microsensors and microsystems to measure infrared radiation, gas flow, pressure, relative humidity, and acceleration;
 
    New process technologies for IC microsensor fabrication;
 
    Micromechanical test structures to measure thermo- electromechanical properties of IC thin films;
 
    Novel sensor packaging technologies
   
1991-1992 Silicon Solar Cell Physics and Technology
 
  • High efficiency (>20%) monocrystalline Si solar cells;
 
    Implementation of boron rear-field technology
   
1987-1991 Surface Physics, Magnetism
 
  • Magnetic surfaces, adsorbates, and thin films using spin-polarized Auger and secondary electron spectroscopy (Ph.D. thesis)
   
1986 Neutron Scattering, Magnetism


 

  • Spin wave and cluster excitations of CsMnx Mg1-x Br3 by inelastic neutron scattering (equivalent of M.S. thesis)


 
 

Professional society affilations, activities, honors
Conference: 2009: Mikrosystemtechnik-Kongress, Transducers, Eurosensors
Program: 2008: Eurosensors, IEEE Sensors, Smart Systems Integration
Comittees: 2007: IEEE Sensors, Smart Systems Integration
  2004: IEEE MEMS 2004 Conference General Co-Chair
  2002-2006: IEEE MEMS Conference International Steering Committee
  1998-2003: IEEE MEMS Conference Technical Program Committee
  1998-2003: IEEE MEMS Conference Technical Program Committee
  1996-1999: SPIE Conferences on Micromachined Devices and Components
  1996: Eurosensors X, Leuven, Belgium
   
Editorial: 2007-date: Transactions on Electrical and Electronic Engineering (IEE Japan)
Board: 2005-date: Journal Micromechanics and Microengineering (IOP)
  1995-date: Sensors and Actuators A (Elsevier)
 
Membership: Institute of Electrical and Electronic Engineers IEEE
   
Journal: Sensors and Materials
Reviewing: IEEE Sensor Journal
  IEEE Transactions on Electron Devices
  IEEE Electron Device Letters
  IEEE/ASME Journal of Microelectromechanical Systems
  Journal of Applied Physics
  Journal of Electroceramics
  Journal of Micromechanics and Microengineering
  Microsystem Technologies
  Nanotechnology
  Sensors and Actuators A
  Thermochimica Acta
   
Awards: IEEE Sensors 2009: with PhD student M. Baumann, 2nd best poster award
  InterPack 2009: with PhD student Benjamin Lemke, best poster award of session
  Eurosensors 2008: with PhD student P. Gieschke, 3rd best poster award
  2007: Arnold-Biber-Award of The German Orthodontic Society, with PD Dr. B. Lapatki
  IEEE Sensor 2003: with PhD student J. Bartholomeyczik receives Samsung Award for 2nd best student paper
  IEEE ICMTS 1999, best paper award
  IMAPS 1998, best paper of session award
  IEDM 1997, PhD student F. Mayer received IEEE R. A. Haken Award
  IEEE ICMTS 1996, best paper award
  Micromechanics Europe 1996 Workshop, best poster award
  Polya Award of ETH Zurich for Best Physics Diploma examination result, 1986
   

Co-Founder:


1998-date: Sensirion AG, Stäfa, Switzerland, with
185+ employees
 
 

Teaching
2008-date CMOS-Integrated Microsystems University of Freiburg
2008-date Semiconductors University of Freiburg
2006-date Solid State Physics for MEMS Engineers University of Freiburg
2005-date Advanced Silicon Technologies, with Dr. P. Ruther and Dr. J. Gaspar University of Freiburg
2004-date Quantum mechanics for micro and nano engineers University of Freiburg
2002-2007 Integrated Microsystems University of Freiburg
2001 Reactive Ion Etching,
with Dr. P. Ruther		 University of Freiburg
1999-date MEMS Material and Device
Characterization, with Dr. P. Ruther and Dr. J. Gaspar 		University of Freiburg
1999-2005 Microsystem Technology Lab Class,
with Dr. P. Ruther		 University of Freiburg
1998-2006 MEMS Materials I University of Freiburg
1998-date Fundamental Materials Science University of Freiburg
1996 Physical Electronics ETH Zürich
1995 Microsystem Technology Brugg Technical College                    Postgraduate Program,
Brugg, Switzerland
1995 Process Integration NEXUS Course of Micromachining,
Bremen, Germany
1993-1998 Microsensors ETH Zürich
1992-1998


 Silicon Technology
ETH Zürich
 
 

Languages

Fluent: German, English, French, Swiss German

Basic knowledge: Italian, Spanish, Japanese





 
 

Patents, publications, presentations

3 patents
Over 280 publications in scientific journals, conference proceedings, books
Over 100 oral scientific presentations



 

© 2004 IMTEK - Letzte Änderungen - edv@imtek.de- 18.08.2009