Projects

The BMBF-funded KompAS project, a collaboration between Hahn-Schickard, AM Extrusion GmbH, Peters Research GmbH & Co. KG, ModuleWorks GmbH, Neue Materialien Bayreuth GmbH, and the Institute of Microsystems Ebgineering (IMTEK) of the University of Freiburg, aims to develop an innovative hybrid additive manufacturing platform for freefrom 3D electronic circuits. By integrating multiple printing technologies, including Fused Filament Fabrication (FFF), high-precision inkjet printing, molten metal deposition, and precise component soldering, the project enables customized, high-performance electronic structures with improved efficiency and sustainability. A key technology enabler, StarJet, allows for non-contact molten metal printing, opening new possibilities for wearable electronics, sensor systems, and smart devices. The Department of Microsystems Engineering (IMTEK) at the University of Freiburg plays a crucial role in process development and material integration. IMTEK focuses on hybrid printing process development of 3D freeform polymer housing via FFF, high performance dielectrics via inkjet, and conductive trace printing via StarJet. The aim is to tune the interaction between printed polymers, dielectrics and metal conductors, ensuring strong adhesion, electrical reliability, and process scalability. With expertise in microfabrication and hybrid manufacturing, IMTEK helps drive the project toward practical industrial applications.